Title:
INFRARED SENSOR CHIP
Document Type and Number:
Japanese Patent JP2014219334
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an infrared sensor chip capable of improving target detection accuracy.SOLUTION: The infrared sensor chip 2 includes: a frame-like frame part 21; a thin film part 22 formed inside of the frame part; plural first electrode parts 6a-6d each formed on the upper face of the thin film part; plural sensor parts 7a-7d each formed on the upper face of the plural first electrode parts; plural second electrode parts 8a and 8b each formed on the upper face of the plural sensor parts; plural first pat 62a-62d and plural second pats 82a-82d which are formed on the upper face of the frame part each connected to the plural first electrode section and plural second electrode section; plural first wirings 61a-61d which are formed on the upper face of the thin film part each connecting the plural first electrode parts and the plural first pats; and plural second wirings 81a-81d having a wire length identical each other, which are formed on the upper face of the thin film part 22 to connect the plural second electrode parts and plural second pats.
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Inventors:
MINAMI NAYUTA
KAJIMOTO TSUYOSHI
MIYATAKE TAKEHIRO
KAJIMOTO TSUYOSHI
MIYATAKE TAKEHIRO
Application Number:
JP2013099810A
Publication Date:
November 20, 2014
Filing Date:
May 10, 2013
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
G01J1/02; H01L31/02; H01L37/02
Attorney, Agent or Firm:
Masakazu Ito
Wood Yasumune
Satoru Hosokawa
Takayoshi Matsumoto
Woods 太士
Wood Yasumune
Satoru Hosokawa
Takayoshi Matsumoto
Woods 太士