To provide a package of an infrared sensor element which can prevent a joint of a lid and an infrared transmitting member from being damaged by a difference in a linear expansion coefficient between the lid and the infrared transmitting member.
The package 1 of the infrared sensor element A includes a package body 2 which is formed in a shape of a rectangular box opened at one side and has the infrared sensor element A provided on the inner bottom 2a, the lid 3 which has an opening for taking infrared rays into the package 1 from the outside of the package 1 and is joined to the package body 2 in a form of covering the one side of the package body 2, and the infrared transmitting member 4 which is provided in a form of covering the opening 3b of the lid 3. The lid 3 is provided with a first thin-walled portion (stress relaxing structure) 3d which is a flexible portion for relaxing thermal stress generated in the joint 5 of the lid 3 and the infrared transmitting member 4 by a difference between the linear expansion coefficient of the material forming the lid 3 and that of the material forming the infrared transmitting member 4.
COPYRIGHT: (C)2010,JPO&INPIT
Mitsuhiko Ueda
Shintaro Hayashi
| JP2569503Y2 | ||||
| JP62151775U | ||||
| JP10132654A | ||||
| JP3897055B1 | ||||
| JP2005228775A | ||||
| JP7280653A | ||||
| JP2008147243A | ||||
| JP2006145610A | ||||
| JP2006222249A | ||||
| JP2001281053A | ||||
| JP4022277Y2 |
Next Patent: 自己免疫疾患を予防し治療するための物質