To provide an infrared sensor module capable of reducing an influence exerted on an infrared sensor by heat generation of an IC element.
A package 3 is constituted of: a package body 4 in which a wiring pattern 46 is formed on a substrate 40 comprising an insulating material, and on which the infrared sensor 1 and the IC element 2 are mounted side by side; and a package lid 5 having a function for transmitting an infrared ray of an inspection object by the infrared sensor 1, and joined airtightly to the package body 4 in the form of enclosing the infrared sensor 1 and the IC element 2 between itself and the package body 4. In the package body 4, a wall part 43 for shielding an infrared ray radiated from the IC element 2 to the infrared sensor 1 side is erected between a first domain 41 where the infrared sensor 1 is mounted and a second domain 42 where the IC element 2 is mounted, and the thickness of the second domain 42 is thinner than the thickness of the first domain 41.
COPYRIGHT: (C)2011,JPO&INPIT
佐名川 佳治
明田 孝典
中村 雄志
桐原 昌男
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