To provide an infrared sensor that obtains high temperature difference between heat-sensitive elements for infrared detection and temperature compensation, is miniaturized, and has an inexpensive structure.
This infrared sensor includes an insulating film 2, a first heat-sensitive element 3A and a second heat-sensitive element 3B that are disposed on one surface of the insulating film 2 and are separated from each other, a plurality of conductive wiring films 4 that are formed on one surface of the insulating film 2 and are separately connected to the first heat-sensitive element 3A and a second heat-sensitive element 3B, an infrared absorbing film 5 that faces the first heat-sensitive element 3A and is disposed on the other surface of the insulating film 2, and an infrared reflecting film 6 that faces the second heat-sensitive element 3B and is disposed on the other surface of the insulating film 2.
NAGATOMO KENSHO
ISHIKAWA MOTOTAKA
JPH07260579A | 1995-10-13 | |||
JPH10318830A | 1998-12-04 | |||
JP2003194630A | 2003-07-09 | |||
JPH0357638U | 1991-06-04 | |||
JPH07235405A | 1995-09-05 | |||
JP2000077207A | 2000-03-14 | |||
JP2003069070A | 2003-03-07 |
Next Patent: PROBABILISTIC DETERMINATION METHOD OF TIME INTERVAL BETWEEN PERIODIC EVENTS DISTURBING SIGNAL