Title:
INFRARED SENSOR
Document Type and Number:
Japanese Patent JP3200657
Kind Code:
B2
Abstract:
PURPOSE: To improve sensor sensitivity by suppressing the infrared energy quantity lost out of an infrared sensing film minimum.
CONSTITUTION: On a silicon base plate 11, two hollow parts 14a, 14b are formed and below these hollow parts 14a, 14b, bridge parts 12a, 12b are formed. On the lower surface of each center of the bridge parts 12a, 12b are provided with infrared sensing films 13a, 13b. On both sides of the silicon base plate 11, a front lid 17 and a back lid 22 are contacted with high melting point solder contact or positive electrode contact method. The surroundings of the infrared sensing films 13a, 13b is sealed under the same vacuum conditions.
Inventors:
Atsushi Sone
Kiyoshi Komatsu
Takehisa Mori
Mitsuteru Kimura
Kiyoshi Komatsu
Takehisa Mori
Mitsuteru Kimura
Application Number:
JP31170992A
Publication Date:
August 20, 2001
Filing Date:
November 20, 1992
Export Citation:
Assignee:
Terumo Corporation
Mitsuteru Kimura
Mitsuteru Kimura
International Classes:
G01J1/02; G01J5/02; G01J5/20; H01L31/02; (IPC1-7): G01J1/02; G01J5/02; H01L31/02
Domestic Patent References:
| JP41535A | ||||
| JP3199933A | ||||
| JP196548A |
Attorney, Agent or Firm:
Yoichiro Fujishima (1 person outside)
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