Title:
赤外線センサ
Document Type and Number:
Japanese Patent JP5736906
Kind Code:
B2
Abstract:
Provided is a lightweight infrared sensor which is readily and stably erected to a substrate. The infrared sensor includes an insulating film; a first and a second heat sensitive element are disposed on one surface of the insulating film separately; a first and second conductive film on one surface of the insulating film and are respectively connected to the first and the second heat sensitive element; and an infrared reflection film on the other surface of the insulating film so as to face the second heat sensitive element. The infrared sensor further includes a reinforcing plate on which a sensor part window corresponding to a sensor part is formed and which is adhered to the insulating film; and a first and a second terminal electrode are respectively connected to the first and the second wiring film, are formed on the edge of the insulating film.
Inventors:
Nakamura Kenzo
Motoki Ishikawa
Gakuji Uozumi
Motoki Ishikawa
Gakuji Uozumi
Application Number:
JP2011076767A
Publication Date:
June 17, 2015
Filing Date:
March 30, 2011
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
G01J1/02; G01J5/02; H01L37/02
Domestic Patent References:
| JP2011013213A | ||||
| JP2005268404A | ||||
| JP2006228768A | ||||
| JP2004061283A | ||||
| JP2003194630A | ||||
| JP2003006584A | ||||
| JP60021425A |
Attorney, Agent or Firm:
Hideyuki Sugiura