Title:
INGOT CLAMP AND WIRE SAWING APPARATUS FOR SLICING INGOT INCLUDING THE SAME
Document Type and Number:
Japanese Patent JP2019106518
Kind Code:
A
Abstract:
To provide an ingot clamp capable of preventing wafer quality deterioration by supporting an ingot in a balanced and stable manner and a wire sawing apparatus for slicing an ingot including the same.SOLUTION: According to the present invention, there is provided an ingot clamp including: a clamp body 210 configured to have a holder mounting groove 211 and a cavity 213; a fixing part configured to support and fix one side of an ingot holder inserted in the holder mounting groove; a movable fixing part disposed in the cavity and the holder mounting groove and configured to press and fix the other side of the ingot holder; a cover assembly coupled with the clamp body and configured to cover the cavity; and an air supply part coupled with the cover assembly and configured to supply air into the cavity.SELECTED DRAWING: Figure 8
Inventors:
KIM WOO TAE
BAE YOUNG SEO
BAE YOUNG SEO
Application Number:
JP2018031594A
Publication Date:
June 27, 2019
Filing Date:
February 26, 2018
Export Citation:
Assignee:
SK SILTRON CO LTD
International Classes:
H01L21/304; B23Q3/02; B23Q11/00; B24B27/06; B24B41/06; B24B55/06; B28D5/04; B28D7/04
Domestic Patent References:
| JPH07308920A | 1995-11-28 | |||
| JPH1177663A | 1999-03-23 | |||
| JP2003534939A | 2003-11-25 | |||
| JP2015512792A | 2015-04-30 | |||
| JP2003251501A | 2003-09-09 | |||
| JP2015090878A | 2015-05-11 | |||
| JP2017148872A | 2017-08-31 | |||
| JPH0864542A | 1996-03-08 | |||
| JP2002120139A | 2002-04-23 | |||
| JPH11147218A | 1999-06-02 |
Attorney, Agent or Firm:
Shigeki Yamakawa
Masaki Yamakawa
Masaki Yamakawa