Title:
INJECTION MOLD APPARATUS
Document Type and Number:
Japanese Patent JP3094268
Kind Code:
B2
Abstract:
PURPOSE: To be able to facilitate the replacement of a mold by providing a link for limiting the mold opening amount between a movable side mold and a stationary side mold plate, and fixing the link to the position where the mold apparatus does not protrude by temporarily fastening means on the outer periphery in the mold clamping state.
CONSTITUTION: The stationary side mold plate 3 of a stationary side mold P is coupled to the movable side mold plate 7 of a movable side mold Q by a link 18. A magnet 22 is engaged with the plate 3 with respect to an iron link 18, and the link 18 is fixed to the home position of the plate 3. At the time of opening the mold, first the plate 3 and a runner stripper plate 2 start to be opened therebetween, then the parting line surfaces R are opened, and eventually the plate 2 and the plate 3 are opened therebetween. At this time, in order to fix the link 18, the magnet 22 fixes the link 18 to the home position. Accordingly, even if the link 18 becomes the mold closing state from the mold opening state, the mold apparatus does not protrude out of the profile of the apparatus.
Inventors:
Hiroshi Noritake
Application Number:
JP12144695A
Publication Date:
October 03, 2000
Filing Date:
May 19, 1995
Export Citation:
Assignee:
Seiko Precision Co., Ltd.
International Classes:
B22D17/22; B22D17/26; B29C33/20; B29C33/44; B29C45/26; B29C45/38; B29C45/40; B29C45/64; (IPC1-7): B29C45/38; B29C45/26
Domestic Patent References:
| JP57144529U |
Attorney, Agent or Firm:
Kazuko Matsuda