Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
INJECTION MOLDING APPARATUS
Document Type and Number:
Japanese Patent JP2004209904
Kind Code:
A
Abstract:

To provide an injection molding apparatus using a simple mold capable of being rapidly and simply altered in its cavity shape corresponding to the shape of a molded product and capable of sufficiently satisfying the demand related to the production of a small lot, the shortening of the time limit of delivery and the decrease in cost.

The injection molding apparatus 1 is equipped with the simple mold 2 having a replacing part 14, which has a cavity 20 formed thereto, and the fixing part 15a fixed to a machine main body part 4, and a control part 5 for controlling the opening/closing operation of the simple mold 2. The replacing part 14 has the fixed template 16 fixed to the fixing part 15a, the movable template 17 approaching and separating with respect to the fixed template 16 and an ejector mechanism 18 for ejecting a molded product 25. A hot runner 12 for sending out a molten resin 3 to the cavity 20 in a molten state is formed to the fixing part 15a and a cold runner 21 for guiding the molten resin 3 sent out of the hot runner 12 to the cavity 20 is formed to the fixed template 16.


More Like This:
Inventors:
TANADA AKINORI
MASUDA KATSUTOSHI
Application Number:
JP2003001893A
Publication Date:
July 29, 2004
Filing Date:
January 08, 2003
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
RICOH KK
YUSEI KIKO KK
International Classes:
B29C45/27; B29C45/28; (IPC1-7): B29C45/27; B29C45/28
Attorney, Agent or Firm:
Tamio Nishiwaki



 
Previous Patent: BONDING BODY

Next Patent: HEAT-SHRINKABLE PACKAGING MATERIAL