To provide an injection molding machine provided with a power semiconductor element consumption monitoring system which further accurately monitors the consumption of a power semiconductor element in a power conversion device with a reduced arithmetic load.
The injection molding machine provided with the power semiconductor element consumption monitoring system 100 which monitors the consumption of the power semiconductor element in the power conversion device 10 includes: an operation state determination unit 451 which determines to which of a plurality of preset operation patterns the operation state of the power conversion device 10 corresponds; a consumption reference table 460 which preliminarily stores each consumption level of the power semiconductor element in the execution of each of the plurality of operation patterns; and a consumption integration unit 452 which acquires and integrates the consumption level of the power semiconductor element when the operation pattern determined by the operation state determination unit 451 is executed in reference to the consumption reference table 460.
JP2003266498 | DATA SETTING METHOD FOR MOLDED ARTICLE EJECTOR |
MIZUNO HIROYUKI
JP2006067690A | 2006-03-09 | |||
JP2000141440A | 2000-05-23 | |||
JP2008206217A | 2008-09-04 |
WO2004082114A1 | 2004-09-23 |
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