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Title:
INJECTION MOLDING SYSTEM, AND INJECTION MOLDING METHOD
Document Type and Number:
Japanese Patent JP2009202482
Kind Code:
A
Abstract:

To provide an injection molding system and method which certainly prevents overshoot of mold temperature at the time of heating.

An average coefficient a' and heating delay ' are obtained from a mold raising temperature curve L1 when heating a mold beforehand, these average coefficient a' and heating delay ' are made to be characteristic set values for every mold. When performing injection molding, an expected temperature rising curve L2 is formed from the average coefficient a' and heating delay ', it is made to suspend feeding of a heating medium based on this curve when heating a mold. The temperature rising situation of a mold is also monitored during injection molding, the average coefficient a' and heating delay ' are obtained, and the temperature TH' which should suspend feeding of a heating medium is sequentially updated from the average coefficient a' and heating delay ' memorized in a last cycle.


Inventors:
BESSHO MASAHIRO
TODA NAOKI
KARIYA TOSHIHIKO
HATTORI MITSUTAKA
Application Number:
JP2008048489A
Publication Date:
September 10, 2009
Filing Date:
February 28, 2008
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND PLASTIC T
MITSUBISHI HEAVY IND LTD
International Classes:
B29C45/73; B29C45/78
Domestic Patent References:
JP2005329577A2005-12-02
JP2007030432A2007-02-08
Attorney, Agent or Firm:
Mitsuru Oba
Horikawa Miyuki



 
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