To provide an injection molding system and method which certainly prevents overshoot of mold temperature at the time of heating.
An average coefficient a' and heating delay ' are obtained from a mold raising temperature curve L1 when heating a mold beforehand, these average coefficient a' and heating delay ' are made to be characteristic set values for every mold. When performing injection molding, an expected temperature rising curve L2 is formed from the average coefficient a' and heating delay ', it is made to suspend feeding of a heating medium based on this curve when heating a mold. The temperature rising situation of a mold is also monitored during injection molding, the average coefficient a' and heating delay ' are obtained, and the temperature TH' which should suspend feeding of a heating medium is sequentially updated from the average coefficient a' and heating delay ' memorized in a last cycle.
TODA NAOKI
KARIYA TOSHIHIKO
HATTORI MITSUTAKA
MITSUBISHI HEAVY IND LTD
JP2005329577A | 2005-12-02 | |||
JP2007030432A | 2007-02-08 |
Horikawa Miyuki