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Title:
INK COMPOSITION AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE
Document Type and Number:
Japanese Patent JP2015193722
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an ink composition having more excellent conductivity after firing and providing thin and more minute conductor pattern such as having line width of less than 50 μm when applied to a method for forming an ink coating film by forming image on a silicone blanket surface and transferring it to a ceramic substrate to print precision pattern on the ceramic substrate.SOLUTION: There are provided an ink composition containing a conductive metal particle (A), a thermoplastic binder resin (B) having heating weight reduction at temperature 700°C on a thermogravimetric measurement of at least 98% or more, a tackifier (C), and an organic solvent (D), and a manufacturing method of a ceramic substrate using the ink composition.

Inventors:
MATSUKI KOICHIRO
YOSHIHARA SUNAO
YATSUGI KENICHI
KATAYAMA YOSHINORI
Application Number:
JP2014072077A
Publication Date:
November 05, 2015
Filing Date:
March 31, 2014
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C09D11/52; H01B1/22; H01B13/00
Domestic Patent References:
JP2005290153A2005-10-20
JP2003059336A2003-02-28
JP2014034589A2014-02-24
JP2010116525A2010-05-27
JP2014500375A2014-01-09
JP2014515160A2014-06-26
Foreign References:
WO2012135551A12012-10-04
Attorney, Agent or Firm:
Kono Tsuyo