To provide a method of forming a conductive material which is excellent in conductivity and adhesion, by forming an ink receiving layer with good fixability on a substrate and patterning and baking metal particulate dispersion on the substrate.
An ink receiving layer (R) is formed on a surface of a substrate (K) to form a conductive pattern thereon by heating and baking a coated or patterned conductive ink (I) that includes a reduction solvent (A) containing metal fine particles (P) and polyhydric alcohol (S1). The ink receiving layer (R) is formed by bonding non-conductive inorganic particles (G) whose surfaces are liquid-repellent treated with a silane coupling agent (C) having a fluoroalkyl group, with a hydrophilic binder (B). The ink receiving layer (R) has an uneven surface according to the inorganic particles (G). The hydrophilic binder (B) present on the ink receiving layer (R) has a hydroxyl group.
IWASHITA TETSUYUKI
FUJIWARA HIDEMICHI
Atsushi Naka