INNER LAYER PATTERN POSITION DETECTING METHOD FOR MULTI-LAYER PRINTED BOARD, DRILLING METHOD AND DEVICE THEREFOR

Japanese Patent JP3253784

B2

PURPOSE: To easily confirm and determine the position of the reference mark of an inner layer through drilling by cutting an inner layer pattern obliquely in the thickness direction, and obtaining the position of the inner layer pattern from the obliquely cut face of the exposed inner layer pattern.
CONSTITUTION: A printed board 9 is fixed to a table 10, and the center of a reference mark of cross shape, for instance, provided at the printed board 9 is obtained from an image pickup result by a CCD camera 31. That is, a hole is bored in the center of the reference mark, provided at the upper layer of the printed board 9, by a drill 42, and the image of the bored position is picked up by the CCD camera 31. The center of the reference mark provided in the inner layer in relation to the reference mark of the upper layer is computed, and the result is stored. A reference position for machining is then determined by a controller 33 on the basis of the obtained result, and the result is outputted to an NC device 32 to perform drilling work. In the case of the reference position being inclined in relation to XY axes, machining position data is coordinate-transformed, and longitudinal correction is performed as occasion calls.

WO/1989/002812	CUTTING GUIDE
WO/2024/089093	NEGATIVE-PRESSURE ELEMENT FOR A (NEGATIVE-PRESSURE) WORK SURFACE
JP2022142685	CUTTING OPERATION TOOL

Tamio Ohtani
Go Yamaguchi
Hideyuki Sumiyoshi

JP31756293A

February 04, 2002

December 17, 1993

Click for automatic bibliography generation  

Hitachi Via Mechanics Co., Ltd.

B26D7/01; B23B41/00; B26F1/16; H05K3/46; (IPC1-7): B26F1/16; B23B41/00; B26D7/01; H05K3/46

JP599616A
JP3270208A
JP5175668A
JP4360793A

Previous Patent: EXPOSURE MASK AND MANUFACTURING METHOD AND DEVICE THEREFOR

Next Patent: PRODUCTION OF COMPOSITE STRUCTURE