To provide an inner peripheral blade grindstone capable of manufacturing a uniform wafer having constant curvature and hardly causing contact of a base metal and ingot even in the case when the base metal is curved by slitting pressure.

A base metal 2 forming an annular plate shape and an electrodeposited abrasive grain layer 3 made by fastening super abrasive grains by a metal plating phase along an overall periphery of its inner peripheral edge part are furnished, a projected part 6 is formed on an inner peripheral end surface of the base metal 2, a distance t1 in the base metal thickness direction from a first surface 2A of the base metal 2 to the projected part 6 is smaller than a distance t2 in the base metal thickness direction from a second surface 2B to the projected part 6, and side surface projected quantity T1 of the electrodeposited abrasive grain layer 3 from the first surface 2A is smaller than side surface projected quantity T2 of the electrodeposited abrasive grain layer 3 from the second surface 2B. Consequently, the maximum projected point 3A of the electrodeposited abrasive grain layer 3 is decentered to the side of the first surface 2A.