Title:
内周面加工装置
Document Type and Number:
Japanese Patent JP7079079
Kind Code:
B2
Abstract:
To reduce the tool cost and improve the processing quality and yield of an inner peripheral surface processing device for processing an inner peripheral surface of each cylinder part of a workpiece having a plurality of cylinder parts arrayed in a row.SOLUTION: An inner peripheral surface processing device 1 for a work W with a plurality of cylinder parts C arrayed in a row, comprises a grinding processing part 10 which grinds an inner peripheral surface of the cylinder parts C by auto-rotating a cylindrical grinding grindstone 11 with an outer peripheral surface thereof in contact with an inner peripheral surface of the cylinder parts C, a work table 31 provided under the grinding grindstone 11 and holding the work W placed on an upper surface, a motor 32 which rotates the work table 31 around a rotation axis ZT, and a movement mechanism 40 that moves the work W on the work table 31 during rotation of the work table 31 so as to sequentially position the work W at each one of processing positions coinciding with a center line ZC of each cylinder part C and the rotation axis ZT of the work table 31.SELECTED DRAWING: Figure 1
Inventors:
Shoji Aoki
Masahiro Kunishige
Masahiro Kunishige
Application Number:
JP2017212858A
Publication Date:
June 01, 2022
Filing Date:
November 02, 2017
Export Citation:
Assignee:
Toyo Advanced Technologies Co., Ltd.
International Classes:
B24B5/08; B24B19/00; B24B41/06
Domestic Patent References:
| JP2139009U | ||||
| JP2014069303A | ||||
| JP56033157U |
Foreign References:
| US20140360355 |
Attorney, Agent or Firm:
Maeda patent office