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Patent Searching and Data


Title:
INORGANIC MATERIAL BOARD AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2003212629
Kind Code:
A
Abstract:

To provide an inorganic material board which is noninflammable and has excellent durability, into which a nail or the like is driven easily and which has strong drawing-out resistance equal to that of plywood when the driven nail is drawn out and to provide a method for manufacturing the inorganic material board.

This inorganic material board is obtained by wet-forming a blend of 15 to 50 mass% lightweight calcium silicate-based hydrate having 0.05 to 0.3 bulk density, 6 to 15 mass% reinforcing fiber, 10 to 60 mass% cement and 0 to 60 mass% filler. The reinforcing fiber consists of a natural fiber and a synthetic fiber of 6:1 to 2:1 mass ratio. This inorganic material board contains ≥2 mass% synthetic fiber having ≥5 kN/mm2 Young's modulus. This inorganic material board is obtained by wet-forming the blend to obtain a green sheet, pressing one green sheet or several stacked green sheets under press pressure of 1 to 20 N/mm2 and subsequently aging/hardening the pressed green sheet.


Inventors:
Owada, Akira
Horikoshi, Senji
Harada, Yoshikatsu
Application Number:
JP2002000009970
Publication Date:
July 30, 2003
Filing Date:
January 18, 2002
Export Citation:
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Assignee:
A & A MATERIAL CORP
International Classes:
C04B28/02; B28B1/52; B28B11/00; C04B14/04; C04B14/38; C04B111/30; (IPC1-7): C04B28/02; B28B1/52; B28B11/00; C04B14/04; C04B14/38
Attorney, Agent or Firm:
曾我 道照 (外6名)