Title:
INORGANIC MICROPARTICLE-DISPERSED PASTE COMPOSITION
Document Type and Number:
Japanese Patent JP2008101167
Kind Code:
A
Abstract:
To provide an inorganic microparticle-dispersed paste composition being excellent in the dispersedness of inorganic microparticles while retaining a viscosity enough for good printability and being capable of being degreased even in a low-temperature atmosphere.
The inorganic microparticle-dispersed paste composition is one containing a (meth)acrylic resin, inorganic microparticles, and an organic solvent, wherein the (meth)acrylic resin has dimethylsiloxane functional groups as part of side chains and having a number-average molecular weight of 3,000-50,000 (in terms of polystyrene).
Inventors:
YAMAUCHI KENJI
IEDA YASUYUKI
FUKUI KOJI
HIRAIKE HIROYUKI
IEDA YASUYUKI
FUKUI KOJI
HIRAIKE HIROYUKI
Application Number:
JP2006286764A
Publication Date:
May 01, 2008
Filing Date:
October 20, 2006
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08L55/00; C08F290/06; C08K3/00; C08K5/00; H01B1/22; H01B3/00; C09K11/00; C09K11/08
Attorney, Agent or Firm:
Yasuo Yasutomi
Katsutoshi Moroda
Katsutoshi Moroda
Previous Patent: ODOR-SUPPRESSING DETERGENT COMPOSITION
Next Patent: PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND OPTICAL FUNCTIONAL FILM
Next Patent: PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND OPTICAL FUNCTIONAL FILM