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Title:
INORGANIC PANEL MATERIAL HAVING EMBOSSED PATTERNS AND PRODUCTION THEREOF
Document Type and Number:
Japanese Patent JPH0890708
Kind Code:
A
Abstract:

PURPOSE: To prevent the generation of warpage at the time of drying in an inorg. panel material having embossed patterns consisting of an hydraulic inorg. material and aggregate, by differentiating the compsn. of the layer on which embossed patterns are formed from that of a flatly formed layer.

CONSTITUTION: A slurry composed of a raw material B and a slurry composed of a raw material A are successively arranged in a form 11 and subjected to clamp molding by an embossing plate 10 for forming embossed patterns 14 and subsequently aged and dried to obtain an inorg. panel material having the embossed patterns 14. The raw material A is a non-synthetic fiber compsn. and the raw material B is a synthetic fiber compsn. Therefore, when both of them are molded under the same clamping pressure, the raw material A is easy to become high in density as compared with the raw material B. By arranging a non-synthetic fibrous raw material A containing no synthetic fiber on the layer 12 having the embossed patterns 14 becoming relatively low in clamping pressure to perform molding, the density difference between the layer 12 having the embossed patterns 14 and a flatly formed layer 13 is reduced to uniformize density as a whole.


Inventors:
IMURA HIROYUKI
Application Number:
JP25462294A
Publication Date:
April 09, 1996
Filing Date:
September 22, 1994
Export Citation:
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Assignee:
DANTANI PLYWOOD CO
International Classes:
B32B3/30; B32B13/00; B32B13/02; (IPC1-7): B32B13/02; B32B3/30; B32B13/00
Attorney, Agent or Firm:
Nakamae Fujio