To provide an insert component which can prevent damage to an electronic component in resin molding, and to provide a resin molded article using the same.

The insert component 11 includes: at least the electronic component 12 having a sensor element 17, a terminal 14 connected to the sensor element 17, and a package resin part 13 formed by integrally molding the sensor element 17 and an end part of the terminal 14 with resin; a circuit board 15 connected to the electronic component 12 by the terminal 14; and a base 16 on which the circuit board 15 is arranged. The base 16 includes at least a wall part 16a to be brought into contact with a surface 13b which is opposite to a surface 13a where the terminal 14 protrudes from the package resin part 13.