Title:
INSERT FILM STRUCTURE AND MOLDING DIE
Document Type and Number:
Japanese Patent JP2020082461
Kind Code:
A
Abstract:
To provide a film for insert molding capable of suppressing a change in pitch of a conductive ink layer in a vacuum pressure molding process.SOLUTION: A film for insert molding comprises a base film, a conductive ink layer provided on one main surface of the base film, and a reinforcing tape provided on the other main surface of the base film, the reinforcing tape having a higher glass transition point than the base film.SELECTED DRAWING: Figure 1-1
Inventors:
MORIOKA HIROSHI
YAMANE SHIGERU
KANEUCHI KAZUHIKO
YAMANE SHIGERU
KANEUCHI KAZUHIKO
Application Number:
JP2018218976A
Publication Date:
June 04, 2020
Filing Date:
November 22, 2018
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
B29C45/14; B29C51/18; B29C51/36
Attorney, Agent or Firm:
Michiko Matsutani
Hiroshi Okabe
Kazuhisa Inaba
Hiroshi Okabe
Kazuhisa Inaba