Title:
INSERT MOLDING POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2003064256
Kind Code:
A
Abstract:
To obtain a polyamide resin composition moldable at a relatively low temperature, having good impact resistance and suitable for insert molding of electronic parts or the like.
The insert molding polyamide resin composition comprises 50-80 pts.wt. of a polyamide resin having a melt peak temperature (Tpm) of from 140°C to less than 210°C and 20-50 pts.wt. of a glass fiber having a fiber length of 0.1-10 mm, wherein the composition has a melt flow rate (MFR) of 100 g/10 minutes or more (230°C, 21.18 N).
Inventors:
OKAMOTO SATOSHI
INOUE TORU
NAKANO TAKAHIRO
INOUE TORU
NAKANO TAKAHIRO
Application Number:
JP2001260885A
Publication Date:
March 05, 2003
Filing Date:
August 30, 2001
Export Citation:
Assignee:
NIPPON PAINT CO LTD
International Classes:
C08L77/00; C08K7/14; (IPC1-7): C08L77/00; C08K7/14
Attorney, Agent or Firm:
Contents Makoto (1 person outside)