To inhibit the occurence of interference between guide members and components provided on a substrate when inserted members are inserted into through holes formed on the substrate with the guide members.

A base member M, which includes multiple inserted members P provided so as to protrude toward multiple through holes H corresponding to the inserted members, is disposed at one side of a plate like substrate B where the multiple through holes H are formed, and a moving member 10, including multiple guide members 20 provided so as to protrude toward the through holes H corresponding to the guide members, is disposed at the other side. The moving member 10 is parallelly moved in a direction that moves close to the substrate B and thereby causing the guide members 20 to be inserted into the corresponding through holes H. Holding parts 22, positioned at tips of the guide members 20, are moved close to or placed in contact with tips of the inserted members P and thereby realizing a holding state of the inserted members. The moving member 10 and the base member M are moved parallelly while maintaining the holding state to insert the multiple inserted members P into the through holes H at one time.