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Title:
INSPECTING APPARATUS OF SUBSTRATE, AND INSPECTING METHOD OF SUBSTRATE
Document Type and Number:
Japanese Patent JP2010080565
Kind Code:
A
Abstract:

To provide an inspecting apparatus of a substrate and an inspecting method of a substrate, for determining inspection conditions without repeatedly radiating electron ray to the same inspection region.

The electron ray is radiated to a substrate where a circuit pattern is formed and a generated secondary electron is detected. The detected signal is made into an image and is stored. The stored image is compared with a second image formed from the other identical circuit pattern. Based on a preset defect discrimination condition, a defect of the substrate is extracted from the comparison result. The inspecting apparatus includes a storage part in which an image of the region within a range of a substrate, from one end to the other end, is accumulated, and a defect determination part for repeatedly determining defects by utilizing the image accumulated in the storage part under a defect determination condition different from the preset defect determination condition.


Inventors:
HAYAKAWA KOICHI
NOJIRI MASAAKI
FUKUNAGA FUMIHIKO
TAMORI TOMOHIRO
Application Number:
JP2008245108A
Publication Date:
April 08, 2010
Filing Date:
September 25, 2008
Export Citation:
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Assignee:
HITACHI HIGH TECH CORP
International Classes:
H01L21/66; G01N23/225
Attorney, Agent or Firm:
Manabu Inoue
Yuji Toda