Title:
INSPECTING DEVICE FOR PACKAGED PRINTED BOARD
Document Type and Number:
Japanese Patent JPS6464070
Kind Code:
A
Abstract:
PURPOSE:To realize an automatic inspecting operation system for packaged printed board by obtaining a common part of the photographed pictures of a chip parts irradiated at different angles and then the electrode position of the chip parts, and inspecting the packaging abnormality of the chip parts based on said obtained common part and electrode position. CONSTITUTION:An illumination drive part 2 selects one of plural types of illumination based on an illumination pointing signal (a) received from a control part 1 and transmits an illumination part drive signal (b). A picture input part 6 pick up an inspection object and delivers a gradation picture signal C. A binarizing part 7 binarizes the signal C by the binarizing level set previously and stores the binarized signals in the 1st-3rd picture storage parts 8-10 based on the storage timing signal delivered from the part 1 and in accordance with the turn-on states of 1st-3rd illumination parts 3-5. A picture comparing part 11 obtains a common part of the signals corresponding to the white of binarized signals f, f' and f'' supplied from the parts 8-10. A chip parts detecting part 12 decides the packing abnormality like the position shift of the chip parts, etc., based on a common binarized picture signal (g).
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Inventors:
NAGAO MASAHIKO
Application Number:
JP22153987A
Publication Date:
March 09, 1989
Filing Date:
September 03, 1987
Export Citation:
Assignee:
NEC CORP
International Classes:
H05K13/08; G06T1/00; (IPC1-7): G06F15/62; H05K13/08
Attorney, Agent or Firm:
Uchihara Shin