PURPOSE: To secure electric continuity of a printed circuit board with mounted components yet to be cleaned by eliminating poor electric continuity attributed to variations in the shape of solder heap in a part to be inspected utilizing a via hole of the printed circuit board with mounted components.
CONSTITUTION: An inspection pin 9 allowed to conduct electrically is brought into contact with the perimeter of an inlet of a via hole 4 of the printed circuit board 1 with mounted components under a specified pressure to generate a detent with a shape of a multi-pyramid at the end part of the via hole 4 as given by the tip of the inspection pin 9. Thus, an oxide film generated in soldering is forced away thereby enabling the creation of highly accurate electric continuity.
FUJITA NAOZUMI
UKO MASATO
MAEDA AKIMITSU
