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Title:
INSPECTION APPARATUS, BONDING SYSTEM, INSPECTION METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM
Document Type and Number:
Japanese Patent JP2014041956
Kind Code:
A
Abstract:

To appropriately inspect an inside of a superposed substrate in which substrates are bonded to each other.

An inspection apparatus 50 for inspecting an inside of a superposed wafer WT comprises: a first holding part 290 for holding a rear surface of the superposed wafer WT and having a notch 295 formed thereon so that a part of the rear surface of the superposed wafer WT is exposed in plan view; a second holding part 310 for holding and rotating the superposed wafer WT; an infrared irradiation part 320 for irradiating the rear surface exposed from the notch 295 of the superposed wafer WT held by the first holding part 290 with infrared ray; and an imaging part 330 for receiving infrared ray applied from the infrared irradiation part 320 and for dividing the superposed wafer WT held by the first holding part 290, into rear surfaces exposed at the notch 295 and imaging them.


Inventors:
KOGA SHINJI
MIYAHARA AKINORI
TOMITA HIROSHI
IWANAGA SHUJI
TAMURA TAKESHI
Application Number:
JP2012184084A
Publication Date:
March 06, 2014
Filing Date:
August 23, 2012
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/66; H01L21/02
Domestic Patent References:
JPS63140543A1988-06-13
JPS63107014A1988-05-12
JP2012512419A2012-05-31
JPH04284647A1992-10-09
JP2007309679A2007-11-29
JP2011187716A2011-09-22
Attorney, Agent or Firm:
Tetsuo Kanamoto
Miaki Kametani
Koji Hagiwara
Naoki Ogita



 
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