Title:
INSPECTION DEVICE AND INSPECTION METHOD
Document Type and Number:
Japanese Patent JP2023061192
Kind Code:
A
Abstract:
To provide an inspection device and an inspection method for appropriately bringing a probe and a substrate into contact with each other, irrespective of the probe height, in a substrate inspection device.SOLUTION: The method comprises: a plurality of positioning members (positioning pins 130) for coming into contact with the top face of a placement member (chuck top 70) or the underside of a holding unit (pogo frame 90) and defining the height of the placement member with respect to a probe 102; an adjustment mechanism 140 for adjusting the height of the positioning member; a detection unit (lower camera 80) for detecting the probe, the placement member and the positioning member; and a control unit. The control unit acquires the height of the probe, acquires the height of the placement member, and acquires the height of the positioning member, and positions, using the adjustment mechanism, the positioning member at a reference height where an overdrive amount is reduced to zero, on the basis of the result of detection by the detection unit. Then the control unit acquires the height of the positioning member that equals a desired overdrive amount, and raises the placement member while adjusting the drive amount of the adjustment mechanism until said height is reached.SELECTED DRAWING: Figure 4
Inventors:
KONISHI KENTARO
Application Number:
JP2021171036A
Publication Date:
May 01, 2023
Filing Date:
October 19, 2021
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/66; G01R31/28
Attorney, Agent or Firm:
Kanemoto Tetsuo
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
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