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Patent Searching and Data


Title:
INSPECTION DEVICE, INSPECTION METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2013015428
Kind Code:
A
Abstract:

To provide an inspection device capable of accurately inspecting a defect of a substrate on the basis of change in an angle of reflected light from an object to be inspected.

The inspection device of the present invention includes: a light source 11 for emitting infrared light; an optical system for making the infrared light emitted from the light source 11 incident substantially perpendicularly onto a wafer 30 as parallel light and guiding reflected light from the wafer 30; and IR cameras 19, 20 for detecting light except specularly reflected light among the reflected light guided by the optical system. An emitting end face of an optical fiber 13 for guiding the infrared light from the light source 11 is arranged at a pupil position of the optical system.


Inventors:
KUSUSE HARUHIKO
SATO YUTA
Application Number:
JP2011148809A
Publication Date:
January 24, 2013
Filing Date:
July 05, 2011
Export Citation:
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Assignee:
LASERTEC CORP
International Classes:
G01N21/956; G01B11/30; H01L21/66
Attorney, Agent or Firm:
Ken Ieiri
Yasuhiro Iwase