To wholly flatten a bottom face height of a division type contact structure in an inspection device of a semiconductor circuit lifted and held in a state that a plurality of the division type contact structures are arranged so as to correspond to each semiconductor circuit on a wafer.

The inspection device having the plurality of the division type contact structures 5 provided with a contact part 10 contactable on the whole electrode pad 3 of each of a plurality of the semiconductor circuits manufactured on a lower face of the wafer 1 on a lower face of a base member 6, lifted and held on the base member 6 in the state that each of the plurality of the contact structures 5 is arranged so as to correspond to each semiconductor circuit and inspecting each semiconductor circuit, is provided with a means for adjusting the bottom face height of the contact structure 5 and wholly flattening each bottom face. Thereby the bottom face height of the contact structure 5 can be wholly flattened to perform a stable wafer burn-in test.