Title:
検査方法および装置、リソグラフィ装置、リソグラフィ処理セルおよびデバイス製造方法
Document Type and Number:
Japanese Patent JP5027731
Kind Code:
B2
Abstract:
A method of measuring a property of a substrate includes generating a patterned mask configured to cause a radiation beam passing through the mask to acquire the pattern, simulating radiating the substrate with a patterned radiation beam that has been patterned using the mask to obtain a simulated pattern, determining at least one location of the simulated pattern that is prone to patterning errors, and irradiating the substrate with the patterned radiation beam using a lithographic process. The method also includes measuring an accuracy of at least one property of the at least one location of the pattern on the substrate that has been determined as being prone to patterning errors, and adjusting the lithographic process according to the measuring.
Inventors:
Den bouff, allie, jeffrey
Cramel, Hugo, Augustine, Joseph
Dusa, Mercy
Setiya, ilwan, mite
Cramel, Hugo, Augustine, Joseph
Dusa, Mercy
Setiya, ilwan, mite
Application Number:
JP2008120101A
Publication Date:
September 19, 2012
Filing Date:
May 02, 2008
Export Citation:
Assignee:
AS M Netherlands B.V.
International Classes:
H01L21/027; G01B11/00; G01B11/24; G01N21/956; G03F7/20
Domestic Patent References:
| JP2003162041A | ||||
| JP2004287400A | ||||
| JP2006012867A | ||||
| JP2006058413A |
Foreign References:
| WO2005079498A2 | ||||
| US20030071994 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Shinji Oga
Toshifumi Onuki
Shinji Oga
Toshifumi Onuki