Title:
Inspection method and equipment and lithography equipment
Document Type and Number:
Japanese Patent JP6316432
Kind Code:
B2
Abstract:
A method of correcting an image characteristic of a substrate onto which one or more product features have been formed using a lithographic process, and an associated inspection apparatus method. The method includes measuring an error in the image characteristic of the substrate, and determining a correction for a subsequent formation of the product features based upon the measured error and a characteristic of one or more of the product feature(s).
Inventors:
Les, Cu, Cub
Deckers, David
Simmons, Hubertus, Johannes, Hertordus
Thomas, Thomas
Deckers, David
Simmons, Hubertus, Johannes, Hertordus
Thomas, Thomas
Application Number:
JP2016536982A
Publication Date:
April 25, 2018
Filing Date:
November 07, 2014
Export Citation:
Assignee:
AS M Netherlands B.V.
International Classes:
G03F7/20; G01B11/24
Domestic Patent References:
| JP2008096434A | ||||
| JP2012084928A | ||||
| JP2009288005A | ||||
| JP2013507604A |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito