Title:
INSPECTION METHOD OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2022065794
Kind Code:
A
Abstract:
To provide an inspection method of a printed wiring board that can accurately inspect the alignment accuracy of a via and an inner land.SOLUTION: An inspection method of a printed wiring board includes preparing a printed wiring board with a product area 1 and an inspection coupon area 2, processing vias 18-1 and 18-2 on an inner layer lands 14-1 and 14-2 of each of the product area and the inspection coupon area, exposing the outer peripheral portion by processing the outer peripheral portion of the inner layer land of the inspection coupon area while processing the via, obtaining the center coordinates (center coordinates OA) of the inner layer land 14-2 of the inspection coupon area on the basis of the position of the exposed outer circumference, obtaining the center coordinates (center coordinates OB) of the via 18-2 on the basis of the shape of the via processed in the inspection coupon area, finding a distance (deviation amount) between the center coordinate OA and the center coordinate OB, and confirming the alignment accuracy between the via and the inner layer land on the basis of the deviation amount.SELECTED DRAWING: Figure 2
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Inventors:
KAWAI YASUHIRO
Application Number:
JP2020174500A
Publication Date:
April 28, 2022
Filing Date:
October 16, 2020
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/46; H05K1/02; H05K1/11; H05K3/00; H05K3/40
Attorney, Agent or Firm:
Ginza Marronnier Patent Office