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Patent Searching and Data


Title:
INSPECTION METHOD OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH05322955
Kind Code:
A
Abstract:

PURPOSE: To obtain an inspection method of a printed wiring board which can reduce the number of signal lines which are connected to an inspection device to a level which is smaller than the number of probes of an inspection tool and perform a complete and efficient inspection even if the number of probes is large inexpensively.

CONSTITUTION: Probes 11-25 of an inspection tool 33 which contacts terminal points A-O on at least two conductor patterns 1-7 which do not have any risk of being short-circuited one another out of a plurality of conductor patterns 1-7 which are formed on a printed wiring board 41 are connected by wiring to form one circuit, the probes 11-25 which contact the terminal points A-O of one of the circuits and a computer 37 are connected by signal lines 11a-14a, 29, and 36, and then continuity test of the conductor patterns 1-7 is performed.


Inventors:
KODERA KATSUHARU
HIBINO TOSHIRO
Application Number:
JP12774192A
Publication Date:
December 07, 1993
Filing Date:
May 20, 1992
Export Citation:
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Assignee:
IBIDEN CO LTD
IBIDEN DENSHI KOGYO KK
International Classes:
G01R31/02; (IPC1-7): G01R31/02
Attorney, Agent or Firm:
Hironobu Onda