PURPOSE: To improve the efficiency of inspection, in the inspection method for a printed wiring board for detecting the positional accuracy to the circuit pattern of the outline processing line made for cutting off one sheet of printed wiring board into a plurality of sheets.

CONSTITUTION: A test pattern 20 is printed on an outline processing line 10, and in the case of having cut off the outline processing line, the test pattern 20 is divided into two test patterns 21 and 22. Through holes 21a and 21b and 22a and 22b are made, respectively, at the ends of these test patterns 21 and 22. In such a constitution of test pattern 10, to detect the positional accuracy of the outline processing line 10, the outline processing line 10 is cut off to begin with, and the test pattern 20 is divided into the patterns 21 and 22. And, the resistance between each through hole 21a and 22b and between 22a and 22b of the patterns 21 and 22 are measured, and based on this measured value, the quantity of dislocation from the design position of the outline processing line 10 is detected.