To provide an inspection method of a semiconductor device, which can prevent the reduction in yield due to increase of contact resistance of electrodes of an inspection socket generated during a test for one lot in the inspection of packaged semiconductor device.
This inspection method comprises the steps of: sequentially attaching at least one semiconductor device of a plurality of first semiconductor devices and at least one second semiconductor device having a plurality of terminals short-circuited in a package to at least one inspection socket having a plurality of electrodes; recognizing whether the attached semiconductor device is a first or second semiconductor device; a measuring the impedance among the plurality of the electrodes of the inspection socket when it has been recognized that the attached semiconductor device is a second one; and cleaning the plurality of the electrodes of the inspection socket determined to have an impedance of not less than a predetermined value.
| JPH08115777 | CONNECTION APPARATUS |
| JPH0878122 | CONNECTION DEVICE |
| JPH021141 | PROBE APPARATUS |
Fujitsuna Hideyoshi
Osamu Suzawa
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