PURPOSE: To inspect the remaining length of the wire between a frame and a capillary when a current becomes zero while supplying the current to the wire thereby to obtain an optimum bonding by cutting the wire fed from the capillary when the wire is cut after the wire is bonded to the final lead frame.

CONSTITUTION: A wire 1 from a wire supply 12 is passed through a capillary 3, first bonded to the electrode of a semiconductor chip 4 on a lead frame 5a, the capillary 3 is then moved, and the wire 1 is bonded to the lead frame 5b at a part where no chip 4 exists to finish a work. A pulse motor 9 and a capillary controller 10 are provided to control at this time. Additionally, a current OFF timing detector 8 and a capillary present position counter 11 are provided, a current is supplied to the wire 1 after the final bonding, clamped by a clamp 7, and pulled up when the wire 1 is cut until the current becomes zero, and cut to set the distance l between the capillary 3 and the frame 5b to an optimum value.