Title:
INSPECTION SOCKET OF SEMICONDUCTOR DEVICE AND INSPECTION METHOD
Document Type and Number:
Japanese Patent JP2005129444
Kind Code:
A
Abstract:
To reduce load applied to a package by breaking an oxide film on a contacting portion between a contact pin and a solder ball by applying ultrasonic vibration to the contact pin and the solder ball, in a socket for inspection.
A socket body 3 includes contact pins 6 each for contacting with an external electrode of a semiconductor device and moving up and down with spring 5 and having a cylindrical tip formed to make an angle of 90 degrees or less; and an ultrasonic vibration apparatus 11 for applying ultrasonic vibration of 60 kHz or more to the contact pins 6.
More Like This:
| JP2019215998 | CONTACT MEMBER AND SOCKET FOR ELECTRICAL COMPONENT |
| JP6475479 | Inspection unit |
Inventors:
MATSUMURA KAZUHIKO
YOSHIDA TAKAYUKI
KAINO NORIYUKI
MATSUMOTO KATSUYOSHI
KAWABATA TAKESHI
YOSHIDA TAKAYUKI
KAINO NORIYUKI
MATSUMOTO KATSUYOSHI
KAWABATA TAKESHI
Application Number:
JP2003365949A
Publication Date:
May 19, 2005
Filing Date:
October 27, 2003
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G01R31/26; G01R1/073; H01R13/04; H01R33/76; (IPC1-7): H01R33/76; G01R1/073; G01R31/26; H01R13/04
Attorney, Agent or Firm:
Mitsutake Murayama