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Patent Searching and Data


Title:
INSPECTION TOOL AND SEMICONDUCTOR DEVICE INSPECTION METHOD
Document Type and Number:
Japanese Patent JP2008232958
Kind Code:
A
Abstract:

To provide an inspection tool that makes it less apt to have the heat from a semiconductor device escape to the outside through contacting an inspection tool from the external electrode of a semiconductor device, when conducting accurate inspection of temperature control.

The periphery of the contact 105 in the inspection tool is surrounded by a substance 201 having thermal conductivity higher than that of the contact 105, and the periphery of the substance 201 having high thermal conductivity is surrounded by a heat-insulating substance (substance having low thermal conductivity) 202, thus preserving the temperature of the contact 105, preventing heat from the semiconductor device 101 from escaping to an inspection board 109 easily through the contact 105, and controlling the temperature accurately.


Inventors:
AKAHORI KOJI
KANEMITSU TOMOHIKO
Application Number:
JP2007075697A
Publication Date:
October 02, 2008
Filing Date:
March 23, 2007
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01R33/76; G01R31/26
Attorney, Agent or Firm:
Yoshihiro Morimoto
Toshiji Sasahara
Yohei Harada