PURPOSE: To prevent connection defects by soldering an earth pattern and an electric connection terminal integrally by solder dip for increasing solder quantity.
CONSTITUTION: Close to a hole 2 in a printed board 2 to which a lug terminal 5 is inserted. small holes 9a, 9b are formed, and an earth pattern 4 is formed to surround the hole 2 and the small holes 9a, 9b. A bent part 7 of the lug terminal 5 is inserted into the hole 2, and in the condition where a wire material 10 is inserted into the small holes 9a, 9b, solder dip is performed. The printed board 1 on which an electronic part of the wire material 10 is mounted is formed on a surface on the opposite side of the earth pattern 4 to be soldered through the hole 2 and the small holes 9a, 9b. At this time. solder 8 is placedincluding the bent part 7 and the wire material 10, so solder quantity is increased to eliminate connection defects, thereby generation of cracks can be prevented.
SUGITA MASAAKI
KATO TAKASHI
YAMASHITA NOBORU
ISHIKAWA TADASHI
SUZUKI TOSHIMITSU
Next Patent: TERMINAL FOR HYBRID INTEGRATED CIRCUIT BOARD