Title:
INSULATED BOARD PROVIDED WITH WATER IMMERSION SENSOR
Document Type and Number:
Japanese Patent JP2002013964
Kind Code:
A
Abstract:
To provide an insulated board provided with a water immersion sensor capable of making water immersion into the immersion sensor prior to an electric circuit of the insulated board and decreasing a packaging area of the insulated board.
To a connecting case 15 for attaching a circuit board 11, a configuration pattern 19 electrically connectable to the circuit board 11 is formed by embedding. The water immersion sensor L is formed by providing a sensor hole 24 at the bottom of a projecting part 17 mounted at the lower part of the connecting case 15 and by trimming a configuration pattern 19a positioned at the sensor hole 24.
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Inventors:
SUGIMOTO SATOSHI
Application Number:
JP2000271790A
Publication Date:
January 18, 2002
Filing Date:
September 07, 2000
Export Citation:
Assignee:
TOKAI RIKA CO LTD
International Classes:
E05F15/16; B60J1/00; B60R16/02; G01F23/24; (IPC1-7): G01F23/24; B60J1/00; B60R16/02
Attorney, Agent or Firm:
Hironobu Onda (1 person outside)