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Title:
INSULATED WIRE
Document Type and Number:
Japanese Patent JP2001155551
Kind Code:
A
Abstract:

To provide a new insulated wire highly resistant to severe drawing and winding free from the damage on the film, and as highly heat resistant as polyamideimide, and further superior for bonding free from foaming by the heat in bonding, on an insulated film near a bonding part.

This insulated wire is formed by successively coating and laminating (1) a first insulating layer substantially composed of polyamideimide and/or polyimide, and (2) a second insulating layer obtained by blending a thermoplastic resin B having a glass transition point of 140°C or more with polyamideimide A by a weight ratio of A/B of 70/30 to 30/70, onto a conductor, a ratio T1/T2 of a film thickness T1 of the first insulating layer and a thickness T2 of the second insulating layer is within a range of 5/95 to 40/60, and the amount of residual solvent is 0.05 wt.% or less of the total amount of the insulating film.


Inventors:
KAMIOKA ISAO
YAMAUCHI MASAAKI
KURATA MASAHARU
ASAI HIROMITSU
MATSUBARA SHINICHI
TAKAHASHI MAKOTO
Application Number:
JP33953699A
Publication Date:
June 08, 2001
Filing Date:
November 30, 1999
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
DENSO CORP
International Classes:
H01B3/30; C09D5/25; C09D179/08; H01B7/00; H01B7/02; H01B7/29; H01B13/16; (IPC1-7): H01B7/02; C09D5/25; C09D179/08; H01B3/30; H01B7/00; H01B13/16
Domestic Patent References:
JPH05190027A1993-07-30
JP2000235818A2000-08-29
JPH05274921A1993-10-22
JPH08222033A1996-08-30
JPH05130759A1993-05-25
JPH05174632A1993-07-13
JPH1153952A1999-02-26
JPH05258614A1993-10-08
JPS4831480A1973-04-25
JPS4997288A1974-09-13
Attorney, Agent or Firm:
Hirokatsu Kamei (2 outside)



 
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