Title:
HEATING/HEAT INSULATING BOARD AND HEATING/HEAT INSULATING CASE
Document Type and Number:
Japanese Patent JP2004095185
Kind Code:
A
Abstract:
To provide a heating plate using a semiconductor heating element and a heating/heat insulating case using the same.
The heating/heat insulating board is composed of a heating plate obtained by integrally holding a heating sheet between a heat insulating plate and a heat transfer plate.
Inventors:
WATANABE MIKIO
TANABE MASAKI
TANABE MASAKI
Application Number:
JP2002215389A
Publication Date:
March 25, 2004
Filing Date:
July 24, 2002
Export Citation:
Assignee:
KID KK
International Classes:
A47F3/04; A47J36/24; A47J39/02; H05B3/20; H05B3/30; (IPC1-7): H05B3/20; A47F3/04; A47J36/24; A47J39/02; H05B3/30
Attorney, Agent or Firm:
Masatsugu Suzuki
Kenichi Wakui
Kenichi Wakui
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