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Title:
絶縁膜用材料、絶縁膜用コーティングワニス、絶縁膜、及びこれを用いた半導体装置
Document Type and Number:
Japanese Patent JP4067850
Kind Code:
B2
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Inventors:
Saito Hideki
Naofumi Enoki
Application Number:
JP2002082006A
Publication Date:
March 26, 2008
Filing Date:
March 22, 2002
Export Citation:
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Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G69/44; C08G73/22; C08L67/02; C08L67/06; C08L77/06; C08L77/10; C09D5/25; C09D167/06; C09D171/00; C09D177/06; C09D177/10; H01B3/00; H01B3/30; H01L21/312
Domestic Patent References:
JP2001354852A
JP2002080718A
JP2001311044A
JP2001279174A



 
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