Title:
INSULATING RESIN COMPOSITION AND RESIN FILM, LAMINATED BOARD HAVING RESIN AND CIRCUIT BOARD PRODUCED BY USING THE COMPOSITION
Document Type and Number:
Japanese Patent JP2002114825
Kind Code:
A
Abstract:
To provide an insulating resin composition having high heat-resistance and insulation reliability and curable with light or heat and provide a method for producing an insulating adhesive material and a circuit board by using the resin composition.
This insulating resin composition curable with light or heat contains a bismaleimide compound and an isocyanuric ring compound having a double bond in the molecule as essential components.
Inventors:
ISHIDA YUKIHISA
TAKANEZAWA SHIN
MORITA MASAKI
WATANABE TAKAKO
TORIKAI KEIGO
TAKANEZAWA SHIN
MORITA MASAKI
WATANABE TAKAKO
TORIKAI KEIGO
Application Number:
JP2000307715A
Publication Date:
April 16, 2002
Filing Date:
October 06, 2000
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08J5/18; B32B27/34; C08F220/34; C08F222/40; C08F226/06; C08L101/00; H05K3/46; (IPC1-7): C08F222/40; B32B27/34; C08F220/34; C08F226/06; C08J5/18; C08L101/00; H05K3/46