To provide an insulating resin composition having low dielectric constant and excellent in other properties, and to provide an insulating resin varnish, a prepreg, an insulating resin film, a laminated board, and a multilayer wiring board.
The insulating resin composition having the low dielectric constant comprises an insulating resin composition and a low dielectric constant-imparting agent, the low dielectric constant-imparting agent is composed of a porous substance and a low dielectric constant-imparting component embedded in the porous substance, and the dielectric constant of the low dielectric constant component in the low dielectric constant agent is smaller than the dielectric constant of the insulating resin composition. The insulating resin varnish, the prepreg, the insulating resin film, the laminated board, and the multilayer wiring board are also provided.
TAKANEZAWA SHIN
WATANABE TAKAKO
ASAKAWA YUSUKE
| JPH08253625A | 1996-10-01 | |||
| JP2006036922A | 2006-02-09 | |||
| JP2010280924A | 2010-12-16 | |||
| JP4661196B2 | 2011-03-30 | |||
| JPH08253625A | 1996-10-01 | |||
| JP2006036922A | 2006-02-09 | |||
| JP2010280924A | 2010-12-16 |
Fusayuki Saito
Satoko Ito
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