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Title:
INSULATING RESIN COMPOSITION AND USE OF THE SAME
Document Type and Number:
Japanese Patent JP2015063702
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that has high transparency and a low dielectric constant, is easily subjected to photo-patterning, has high heat resistance, and can be used in a film form.SOLUTION: An embodiment of the present invention relates to a norbornene-type polymer and a photosensitive insulating resin composition formed from the polymer. Another embodiment relates to a film formed from the composition, and to devices such as electrical, electronic and optoelectronic devices including the film.

Inventors:
AMOROSO DINO
BRIAN BEDWELL
BELL ANDREW
ELCE EDMUND
GAN DAOJI
KANG SEOK HO
MAKABE HIROAKI
RAJESH RAJA PUTHENKOVILAKOM
RAVIKIRAN RAMAKRISHNA
SHICK ROBERT
TAKAHASHI YASUNORI
TAKEUCHI ETSU
WU XIAOMING
Application Number:
JP2014259495A
Publication Date:
April 09, 2015
Filing Date:
December 22, 2014
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08F32/08; G03F7/023
Domestic Patent References:
JP2004161827A2004-06-10
JP2004161827A2004-06-10
Foreign References:
WO2003050158A12003-06-19
WO2003050158A12003-06-19
Attorney, Agent or Firm:
Sumio Tanai
Osamu Mikuni
Shunsuke Fushimi