To provide an insulating resin compound for a multilayer printed wiring board having an excellent heat resistance and a high adhesive strength between an insulation layer and a conductive layer at a low price.
An insulation resin compound for a multilayer printed wiring board having photohardening and thermohardening properties which can be developed by dilute alkali solution, comprising a bisphenol type epoxy resin compound at least as a photohardening resin, an ultraviolet ray hardening resin A obtained by reaction between a reactant of unsaturated monocarbonic acid and saturated or unsaturated basic anhydride, a multifunctional epoxy resin B as a thermal hardening component, an epoxy compound C and a photopolymerization starting agent D having both photohardening component and a thermal hardening component, and also a filler E.
KAWAMOTO KENJI
MATSUMOTO YUICHI
WATANABE JIRO
KAWACHI SHINJI
