Title:
INSULATING RESIN SHEET PASTING METHOD IN PLASMA TREATMENT APPARATUS
Document Type and Number:
Japanese Patent JP2004128410
Kind Code:
A
Abstract:
To provide a method which allows no air bubble and wrinkle, and simply pastes when pasting a resin sheet on an electrode for treating plasma having a large area.
A resin sheet 5 is pasted to an electrode 2 using a difference in conductance between the conductance between the resin sheet 5 and the electrode 2, and the conductance between it and the upper space of the resin sheet 5 by a process returning a decompressed chamber 1 to an atmospheric pressure. The method is realizable using the existing apparatus of a plasma apparatus, and prevents the occurrence of the air bubble and wrinkles without investment in plant and equipment.
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Inventors:
YAMAGUCHI NAOSHI
KIMURA TEIICHI
SEKIGUCHI HIROYOSHI
YANAGI YOSHIHIRO
MORITA MASAFUMI
KIMURA TEIICHI
SEKIGUCHI HIROYOSHI
YANAGI YOSHIHIRO
MORITA MASAFUMI
Application Number:
JP2002293934A
Publication Date:
April 22, 2004
Filing Date:
October 07, 2002
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05H1/46; C23C16/44; C23C16/505; H01L21/3065; (IPC1-7): H01L21/3065; C23C16/44; C23C16/505; H05H1/46
Attorney, Agent or Firm:
Kenhide Okazaki
Toshio Nishizawa
Toshio Nishizawa