Title:
INSULATING RESIN SHEET AND WIRING SUBSTRATE MANUFACTURED BY USING THE SAME
Document Type and Number:
Japanese Patent JP2005179397
Kind Code:
A
Abstract:
To provide a halogen-free wiring substrate having a low percentage of water absorption and a low dielectric dissipation factor, suitable for high-frequency use and having good flame retardance.
The insulating resin sheet is obtained by impregnating a fiber substrate 1 with a thermosetting resin composition 2 prepared by adding and mixing 100 pts. mass of a modified polyphenylene ether resin with 1-10 pts. mass of a cross-linking agent, 10-40 pts. mass of an elastomer for imparting flexibility, 10-50 pts. mass of a flame retardant composed of a phosphazene compound and 30-100 pts. mass of an inorganic insulating filler composed of a metal hydroxide.
Inventors:
KIRIKIHIRA ISAMU
Application Number:
JP2003418488A
Publication Date:
July 07, 2005
Filing Date:
December 16, 2003
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
C08J5/04; C08K3/22; C08L71/12; H05K3/46; (IPC1-7): C08J5/04; C08K3/22; C08L71/12; H05K3/46